Senior Technical Program Manager
The Microsoft Quantum 1st Hardware Quantum TPM team is seeking a Senior Technical Program Manager to drive programs in quantum hardware stacks, including the end-to-end quantum Program, with a deep technical foundation in device development, chip design, and system integration—not network infrastructure. This role will lead end-to-end hardware development programs from concept to integration. You’ll collaborate across hardware, software, and research teams to drive execution, manage dependencies, and ensure the successful delivery of complex, multi-partner projects. Key Responsibilities Lead cross-functional engineering programs spanning device design, chip development, and system integration. Develop, track, and manage project plans, schedules, budgets, and scope for advanced hardware R&D programs. Partner with hardware engineers, chip designers, and manufacturing teams to align technical deliverables and milestones. Facilitate collaboration between internal engineering teams and external component vendors Team will work with US Government, hence the candidates should be the status eligible to work. Team will support both Device/System design, development, integration, Test and Measurement, and customer interfacing. Oversee integration of hardware, firmware, and software components into cohesive quantum systems. Track dependencies and risks, ensuring proactive mitigation and on-time program delivery. Ensure alignment across stakeholders through influence-based leadership—not direct authority. Promote use of structured project management methodologies and best practices throughout the R&D lifecycle. Required/Qualifications: Bachelor’s or master’s degree in electrical engineering. Master’s or PhD in a relevant technical discipline (e.g., Electrical Engineering, Quantum Physics, ASIC/FPGA, Device Physics). Prior exposure to semiconductor, ASIC, FPGA, or hardware systems programs. Experience in hardware development, lab environments, or advanced computing platforms. 10 years of experience with Project Management & managing hardware or system-level engineering programs. Proven success leading device or chip development initiatives—preferably in high-tech environments such as Samsung, Intel & AMD, Qualcomm, Apple, or similar. Strong understanding of chip integration, low-level system integration, and end-to-end device creation. Experience coordinating complex technical programs with multiple stakeholders and dependencies. Excellent program management skills, including scheduling, budgeting, and resource planning. Proficiency with Microsoft Project, Excel, PowerPoint, and Azure DevOps (ADO) or similar tools. Having an Electrical Engineering, Computer Engineering or other relevant engineering degree will work. Preferred: Experience with cryogenic or low-temperature environments, relevant to quantum device development. Background in manufacturing or design engineering management. Exposure to hardware R&D programs. Strong interpersonal and communication skills—able to influence and drive results across cross-functional teams. Soft Skills Technically credible and comfortable discussing engineering trade-offs. Collaborative, adaptable, and able to thrive in a fast-paced, evolving research environment. Skilled at managing through influence, aligning diverse teams toward shared outcomes. Balances strategic thinking with hands-on execution and accountability